San Bruno, Calif.–(Business Wire)–Edge AI innovator Femtosense today announced the arrival and successful testing of its first silicon, confirming the start-up’s claims to deliver significantly higher performance, lower cost and real-time AI processing for valuable and affordable consumer electronics. At the Consumer Electronics Show (CES) in Las Vegas on January 5-8, FemtoSense will showcase advanced audio applications developed with a new AI processor, such as noise suppression and speech enhancement technologies for hearing aids, earbuds and other wearable devices.
“We now have what consumer electronics manufacturers have been asking for: real silicon they can test to create highly efficient and affordable applications that have not been possible until now,” said Sam Folke, Ph.D., CEO and co. – Founder, FemtoSense. “We are already working with partners and customers to evaluate and develop products that enable unprecedented features in small-scale battery-powered applications, from home security, to televisions and audio in vehicles. .”
Imec claims that the femtosense chip is a first-pass success at the silicon production level and a proven work function used at the product level.
Until FemtoSense, AI required too much power and was too expensive to power sophisticated AI applications outside of datacenters or flagship phones. By leveraging sparse math, FemtoSense’s AI implementation eliminates redundant work in AI to significantly improve performance.
To develop the chip, Femtosense partnered with Imec.IC-link, a complete ASIC (Application-Specific Integrated Circuit) solutions provider that can manage the entire product lifecycle.
“Femtosense and IC-link are involved in the early stages of ASIC development,” said Yiyi Wang, president of Imec.IC-link North America. “We believed in Femtosense’s technology, which could be implemented for many edge AI applications requiring a combination of low latency, low power and low cost. IC-link foundry provided tap-out, silicon manufacturing and back-end packaging services. We were impressed by Femtosense’s design and engineering capabilities, and We are very proud of how quickly this team can sort out the design with all the features and turn out the first silicon within months.We are very proud to hear great feedback from their consumer electronics manufacturers.
In October, Femtosense raised $8 million in Series A funding led by Fine Structures Ventures. The company will use the funding to accelerate development and delivery of the chips. FemtoSense expects volume production in 2023.
See Femtosense at CES
FemtoSense will demonstrate its new built-in-chip applications at CES, January 3rd (location) and at booth #60251 at Eureka Park, Venice Expo, during the show, January 5-8, in Building G.
About Femtosense, Inc.
Founded in 2018, FemtoSense brings large-scale, real-time AI to the edge with little math and processing. FemtoSense’s technology distills neuromorphic principles to bring the full potential of AI to key markets including hearables, hearing aids, wearables, residential/commercial security, televisions and automotive. The company’s technology is the result of more than 50 years of cutting-edge research. Femtosense is based in California and has partners worldwide. For more information, visit www.femtosense.ai.